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Event address: Shenzhen International Convention and Exhibition Center (Hall 7)
Event Notice:
Forum Meeting: 2024 International Summit Forum on the Development of Thermal Conductive and Cooling Materials and Thermal Management Industry Conference (June 26-28)
1. After registration is completed, take a screenshot and save this interface
2. Please save the QR code and scan it on-site to enter the venue
3. Admission time for visitors: June 26th to 28th (9:00-17:30)
4. Visitors are requested to cooperate with on-site staff guidance and maintain appropriate social distance
